Course Title:
Wire Bonding
Country:
Venue:

'There are no events currently scheduled for this course

Suitable for:

Production line supervisors, wire bonding operators and quality personnel requiring greater knowledge and practical training; and for electronics engineers, designers and technologists seeking greater awareness of this production process.

Course Content:

An introduction to ultrasonic wire bonding for microelectronics interconnection. All aspects of the process are addressed in both theoretical and practical terms: introduction to the theory of the process; quality control issues; practical sessions including ball/wedge and wedge/wedge bonding; mechanical testing; visual inspection; process optimisation and control; troubleshooting.

Course attendees are encouraged to bring samples relevant to their typical applications for discussion and review.


Course Objectives:
  • To address theoretical, practical and testing aspects of wire bonding
  • To ensure best practice in manufacturing using wire bonding

Additional Information:

Basic operation of wire bonding equipment and the ability to thread 25µm wire into wedge or capillary tools are beneficial.

All TWI courses can be tailored to a company's requirements.

ENTRY REQUIREMENTS:
Basic operation of wire bonding equipment and the ability to thread 25µm wire into wedge or capillary tools are beneficial.

Career Progression: