Production line supervisors, die attach operators, packaging engineers and quality personnel requiring greater knowledge and practical training in materials, processes and fault finding, to improve yield, quality and reliability.
The course will provide attendees with an intensive introduction to the processes used in the manufacture of microelectronic devices and will cover: die attachment adhesive, solder and alternatives; interconnection methods; wire bonding and flip-chip processes; device protection; hermetic sealing and encapsulation.
All processes covered will include a study of material selection; equipment; process control; inspection; rework; reliability and failure mechanisms.
- To review the range of available techniques and materials for initial attachment of silicon devices to substrates
- To ensure best practice in manufacturing using die attachment
All TWI courses can be tailored to a company's requirements.