Course Title:
Electronics Packaging Technology

'There are no events currently scheduled for this course

Suitable for:

Production line supervisors, die attach operators, packaging engineers and quality personnel requiring greater knowledge and practical training in materials, processes and fault finding, to improve yield, quality and reliability.

Course Content:

The course will provide attendees with an intensive introduction to the processes used in the manufacture of microelectronic devices and will cover: die attachment adhesive, solder and alternatives; interconnection methods; wire bonding and flip-chip processes; device protection; hermetic sealing and encapsulation.

All processes covered will include a study of material selection; equipment; process control; inspection; rework; reliability and failure mechanisms.

Course Objectives:
  • To review the range of available techniques and materials for initial attachment of silicon devices to substrates
  • To ensure best practice in manufacturing using die attachment

Additional Information:

All TWI courses can be tailored to a company's requirements.

Career Progression: