Course Title:
Flip Chip Assembly

'There are no events currently scheduled for this course

Suitable for:

Designers and engineers needing a thorough grounding in the process.

Course Content:

The course will include but is not limited to: Introduction to flip-chip technology; attachment methods; materials; equipment; quality and reliability issues; inspection; non-destructive examination; competing technologies; practical sessions.

Course Objectives:
  • To introduce delegates to flip-chip technology
  • To understand the benefits and limitations of the process